MEMS Packaging Market to Reach $2.3B value by 2016

In package unit shipments, the MEMS packaging market is growing 2x

faster (~ 20% CAGR)  than what is predicted for the overall IC package

market. WLP / TSV platform is set to grow the fastest while leadframe

and organic laminate based packages are poised to grow a comfortable 16%

CAGR over the next 5 years to come....

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Published By: Electronics.ca Publications - Tuesday, 24 April, 2012