In package unit shipments, the MEMS packaging market is growing 2x
faster (~ 20% CAGR) than what is predicted for the overall IC package
market. WLP / TSV platform is set to grow the fastest while leadframe
and organic laminate based packages are poised to grow a comfortable 16%
CAGR over the next 5 years to come....
Published By: Electronics.ca Publications - Tuesday, 24 April, 2012