Renewable Energy | Advanced Technology Research (ATR) News Wire

ON Semiconductor Awarded Title III Government Funding for Development of Advanced Next-Generation Star Tracker Image Sensor

Wed, 22 May 2013 02:00:00 CDT

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PHOENIX, Ariz. – May 22, 2013 – ON Semiconductor (Nasdaq: ONNN), driving innovation in energy efficiency, has collaborated with SRI International and Ball Aerospace & Technologies Corp. to secure funding for the Defense Production Act Title III, Advanced Complementary Metal Oxide Semiconductor (CMOS) Focal Plane Arrays (FPA) for Visible Sensors for Star Trackers (VSST) Project. The goal of the project is to increase the availability of domestically produced visible imagers, manufactured using advanced CMOS technology, that are designed to enable flexible visible imaging systems for use on-board satellite systems for Department of Defense and other U.S. Government needs.

To meet the goals of the Staring Technology for Enhanced Linear Line-of-sight Angular Recognition (STELLAR) program, the companies will work together to define the specifications and develop an advanced 2D visible image sensor. Each member of the STELLAR team brings unique and complementary capabilities to the project team. ON Semiconductor brings its on-shore and highly modular 180-nanometer CMOS process technology along with its extensive experience designing high performance CMOS image sensors using both rolling and global shutter technology. Ball Aerospace brings deep understanding of star tracker systems and will drive the specification of the CMOS focal plane array as well as the end-system qualification aspects of the devices. SRI International brings extensive experience in designing focal plane arrays for space applications, along with a highly advanced backside illumination (BSI) processing capability based on its ultra-thin silicon on insulator (UTSOI) technology.

The ONC18 CMOS process manufactured at ON Semiconductor’s on-shore 8-in wafer fabrication facility in Gresham, Oregon, is an ideal platform for developing low power and highly integrated digital and mixed-signal application-specific integrated circuit (ASIC) devices. The STELLAR program will further expand the ONC18 process to include pinned photodiode and transfer gate devices. Combined with ON Semiconductor’s long term commitment to maintain and support process technologies, this capability enabling development of advanced CMOS image sensors will extend supply availability.

“The addition of an image sensor module to our ONC18 platform reinforces our commitment to the space-level DoD business and the overall image sensor market,” stated Vince Hopkin, vice president, Mil/Aero, Digital, Foundry, IPD and Image Sensor products division at ON Semiconductor. “The ONC18 image sensor process capability will enable a second source capability for the markets we serve including machine-vision, high-speed and biometrics.”

SRI International

SRI is a leader in the development of charge-coupled device (CCD) and CMOS image sensors for applications requiring high performance including star trackers. SRI’s contributions to the STELLAR team will include radiation-tolerant imager design, high performance pixel design, low noise readout circuitry, high sensitivity silicon back thinning, and space qualified packaging and testing. “In collaboration with ON Semiconductor, SRI will develop an advanced on-shore image sensor processing capability that leverages SRI’s UTSOI back-side illumination technology,” stated John Tower, technical director, Imaging Group, Products and Services Division at SRI. “This capability delivers improved sensor performance in a commercially available CMOS process.”

A pioneer in backside illumination, SRI has developed patented methods of processing silicon wafers to provide an unobstructed path for light to reach the pixels in its image sensors. SRI innovations in BSI date back to the 1970’s, when the group was part of the RCA David Sarnoff Research Center. SRI’s imagers are also widely used in precision scientific instrumentation, space missions, semiconductor inspection, military night vision systems, airborne reconnaissance, security and surveillance, and other areas where high speed, high sensitivity, and high resolution are critical to mission success.

Ball Aerospace & Technologies Corp.

The VSST program is designed to produce a visible image sensor that can be directly inserted in a star tracker assembly. Star trackers are an integral component of spacecraft guidance and control systems and are used to find a spacecraft’s attitude (the direction it is pointed) in space. “Because commercial CMOS image sensors are not well suited to meet the requirements of a star tracker, the STELLAR development will provide a domestically produced image sensor at a reasonable cost point,” said Kyle Miller, business area manager for Ball Aerospace star tracker products. Ball Aerospace plans to incorporate the STELLAR image sensor into a variety of star tracker and attitude sensor products. These products will be available to spacecraft providers in the DoD, commercial, and civil space markets.

About SRI International

Innovations from SRI International have created new industries, billions of dollars of marketplace value, and lasting benefits to society—touching our lives every day. SRI, a nonprofit research and development institute based in Silicon Valley, brings its innovations to the marketplace through technology licensing, new products, and spin-off ventures. Government and business clients come to SRI for pioneering R&D and solutions in computing and communications, chemistry and materials, education, energy, health and pharmaceuticals, national defense, robotics, sensing, and more. For more information, visit www.sri.com.

About Ball Aerospace

Ball Aerospace & Technologies Corp. supports critical missions for national agencies such as the Department of Defense, NASA, NOAA and other U.S. government and commercial entities. The company develops and manufactures spacecraft, advanced instruments and sensors, components, data exploitation systems and RF solutions for strategic, tactical and scientific applications. For more information visit www.ballaerospace.com.

Case Number: 88ABW-2013-2200

ON Semiconductor to Present its Latest Semiconductor Solutions at “Automotive Engineering Exposition 2013”

Wed, 22 May 2013 02:00:00 CDT

Automotive Engineering Exposition – YOKOHAMA, Japan – May 20, 2013 – ON Semiconductor Corporation (Nasdaq: ONNN), driving innovation in energy efficiency, will present its latest automotive semiconductor solutions at the Automotive Engineering Exposition 2013, from May 22-24 at the Pacifico Yokohama.

A team of experienced engineering experts from ON Semiconductor and the company’s SANYO Semiconductor division will be available to discuss and demonstrate a broad range of solutions for near-future automobiles, and introduce new products that play key roles throughout automotive electronics.

“ON Semiconductor leads the industry by delivering innovative silicon technology that significantly improves power factor, efficiency in active state, and power consumption in standby state for a wide range of products including automotive subsystems, white goods, smartphones, and lighting devices,” said Akihiro Sato, general manager, Field Application Engineering Department of SANYO Semicon Device Co. – which is ON Semiconductor’s sales company in Japan. “For automotive customers, we are committed to the continued development of a wide variety of targeted solutions from body electronics and powertrain to LED lighting and infotainment applications.”

The products and solutions to be demonstrated and discussed at the Automotive Engineering Exposition include the following:

Body and Powertrain

The STK984-09 is a 3-phase BLDC motor driver hybrid integrated circuit (HIC) that features a pre-driver and power MOSFET. It incorporates shunt register, thermistor, and various protective functions against over-temperature, over-current, and over-voltage, featuring low-voltage operation. Optimized for use in automotive radiators, blower fans, and water pumps, this device makes the design of BLDC motor drive circuit easy and reduces the PCB area.

The NCV7729 is an intelligent, fully protected H−Bridge Driver designed specifically for control of DC and stepper motors in safety critical applications in automotive and industrial environments. It is an optimum driver IC for electronic throttle control (ETC), exhaust gas recirculation (EGR), and other automotive functions.

ON Semiconductor has a long history of designing and manufacturing application specific integrated circuits (ASICs) and today offers both mixed-signal and digital ASIC solutions to leading manufacturers in a variety of markets including automotive, medical, industrial, mil/aero, and communication. The company’s ASIC technology addresses diverse automotive devices including sensors, interfaces for high-voltage applications, key-less entry, IVNs such as CAN/LIN, and power management applications.

LED Lighting Products

The NCV78663 is a high efficient smart dual LED driver designed for automotive front lighting applications like high beam, low beam, daytime running light (DRL), turn indicator, fog light, and so on. The NCV78663 provides a solution to drive two strings up to 60 V with minimum external components.

Infotainment Products

The LC717A00AR is a capacitance-digital-converter LSI for electrostatic capacitive touch sensors. Achieving high sensitivity and high noise immunity, it detects the ON/OFF state of each input and outputs the appropriate result without the need for any additional components or control software. Low cost design is possible because the price of one switch is comparable to a tactile switch.

The LC74900 is a LCD processor LSI for small size display that can input digital video signals from the main controller to display on the car navigation screen. It is optimized for car navigation systems and display audio systems, featuring a variety of picture quality adjustment functions for enhanced video quality and content-adaptive backlight control (CABC) for reducing power consumption.

Please visit ON Semiconductor at Booth 178.

Batteries & Supercapacitors in Consumer Electronics 2013-2023: Forecasts

Tue, 21 May 2013 00:00:00 CDT

This report leads you from the basic concepts to understand the

technologies in the energy storage industry including the advantages and

limitations of different technologies. This is followed by a

comprehensive section of the supercapacitor technology explaining where

they fit in the energy storage industry and their potential

applications. Finally it introduces the emerging and future technologies

in the energy storage space: Thin Film and Flexible Batteries. We

present both for batteries and supercapacitors their current research

and development paths leading to improvements. Through these sections we

highlight the work of the companies involved in this industry.

Expanding from previous editions we present potential cost reduction

paths for lithium batteries, drivers of the consumer electronic

industry, the potential role of super capacitors and innovative

technologies and their niche markets. In addition this report presents

IDTechEx's comprehensive study of companies in the lithium battery

industry: 138 manufacturers of lithium-based rechargeable batteries,

including their country, cathode and anode chemistry, electrolyte

morphology case type and application priorities. We present a 10 year

forecast on lithium batteries, supercapacitors, RFID and wireless

sensors applications.

Supercapacitors: World Markets, Technologies & Opportunities: 2013-2018

Tue, 21 May 2013 00:00:00 CDT

This new report covers the global market for carbon and hybrid

supercapacitors with forecasts to 2018. The report addresses global

supercapacitor demand by configuration (coin cell, radial, flatpack/SMD;

screw terminal, snap-mount and module assembly); global value of

supercapacitor demand by end-use market segment in transportation,

consumer AV, renewable energy, professional electronics and

infrastructure markets worldwide. The value of demand is also estimated

based upon circuit application (Memory protection, energy recoup,

actuated power and UPS system). Global consumption is estimated by

world region in Asia-Pacific, Europe and the Americas, and

supercapacitor point of sale analysis is also given for Japan, USA,

China, Korea, Europe and Israel. Supercapacitor costs to produce are

addressed, as are the corresponding markets for carbon materials,

cans/sleeves, electrolytes, end seals, separator materials, electrode

tab materials and lugs and lead wires. A competitive analysis is also

given that addresses the activities of 40 companies in supercapacitors

globally and offers complete assessment of worldwide sales and market

shares.

LAURA BLACKMER JOINS SHARP ELECTRONICS AS SENIOR VP OF SALES FOR SHARP IMAGING AND INFORMATION COMPANY OF AMERICA (SIICA)

Mon, 20 May 2013 15:12:00 CDT

Mahwah, NJ - May 20, 2013 -- Sharp Imaging and Information Company of America (SIICA), a division of Sharp Electronics Corporation, announced today that Laura Blackmer will be joining SIICA as its new Senior Vice President, Sales. In this position, Ms. Blackmer will report directly to President Doug Albregts and will be primarily responsible for directing the strategic growth and profitability of Sharp's Business to Business (B2B) operations with respect to achieving the objectives of increasing sales, market share and maintaining high levels of profitability.

"We’re thrilled to have Laura join our team as the Senior VP of Sales," said Doug Albregts, President, Sharp Imaging and Information Company of America. "She brings a vast wealth of knowledge and expertise that will strengthen our efforts in becoming a best-in-class partner organization and further expand our relationships with both dealers and end customers."

Laura Blackmer comes to SIICA from Intermec, Incorporated where she spent more than three years as the company's Senior Director of North America Channel Sales. While at Intermec, she was responsible for all sales reported through each of the company's operational channels. Prior to that, Blackmer served as the Senior Vice President of Sales at Onforce, Incorporated, preceded by nearly two decades in sales and executive management at Hewlett-Packard Corporation. During her tenure at HP, she held the positions of Vice President, Sales, Commercial Channels; Director of Business and Segment Management, Solutions Partners Organization; Vice President, Small Medium Business, Customer Solutions Group, Americas; and Vice President, Commercial Channels, Imaging and Printing Group, Americas. Ms. Blackmer brings strong leadership and a proven track record for developing and executing successful operating plans across all channels and platforms.

"Sharp is a high-profile brand, globally recognized for its products and innovations, and I'm very excited for the opportunity to join the B2B organization," said Blackmer. "Sharp has a history of establishing high standards and attaining its objectives, so I look forward to the unique challenge of creating and executing strategies that further accelerate the brand in the market."

Sharp Electronics Corporation is the U.S. subsidiary of Japan's Sharp Corporation, a worldwide developer of one-of-a-kind home entertainment products, appliances, networked multifunctional office solutions, solar energy solutions, LED lighting and mobile communication and information tools. Leading brands include AQUOS® Quattron™ LCD televisions and 3DTVs, SharpVision® projectors, Insight® Microwave Drawer® ovens, Notevision® multimedia projectors and Plasmacluster® air purifiers.

For more information visit Sharp Electronics Corporation at www.sharpusa.com. Follow us on Facebook, or Twitter and watch us on YouTube.

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Magnetic Materials - A Global Strategic Business Report

Sun, 19 May 2013 00:00:00 CDT

This report analyzes the worldwide markets for Magnetic Materials in US$

Million by the following Product Segments: Soft Magnetic Materials

(Soft Ferrite, and Electrical Steel), and Permanent Magnetic Materials

(Alnico Magnets, Hard Ferrite, Samarium Cobalt Magnets, and NdFeB

Magnets). The report provides separate comprehensive analytics for the

US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of

World. Annual estimates and forecasts are provided for the period 2010

through 2018. A six-year historic analysis is also provided for these

markets.The report profiles 220 companies including many key and niche

players such as Advanced Technology & Materials Co., Ltd., Beijing

Jingci Magnetism Technology Co., Beijing Zhong Ke San Huan Hi-Tech Co.,

Ltd., BGRIMM Magnetic Materials & Technology Co. Ltd., Electron

Energy Corp., Hitachi Metals Ltd., Hitachi Metals America Ltd., Hengdian

Group DMEGC Magnetics Co., Ltd., Hoosier Magnetics Inc., Jiashan

Pengcheng Magnets Co Ltd., JFE Ferrite Corporation, Magnetics, Inc.,

Master Magnetics, Inc., Ningbo Ketian Magnet Co., Ltd., Ningbo Permanent

Magnetics Co Ltd.

Superconducting Magnets - Global Strategic Business Report

Sun, 19 May 2013 00:00:00 CDT

This report analyzes the worldwide markets for Superconducting Magnets

in US$ Million. The report provides separate comprehensive analytics for

the US, Canada, Japan, Europe, Asia-Pacific, Latin America, and Rest of

World. Annual estimates and forecasts are provided for the period 2009

through 2017. Also, a six-year historic analysis is provided for these

markets. The report profiles 32 companies including many key and niche

players such as Advanced Magnet Lab, Inc., Agilent Technologies, Inc.,

American Magnetics, Inc., ASG Superconductors S.p.A, Babcock Noell GmbH,

Bruker Energy & Supercon Technologies Inc., Eriez Manufacturing

Co., Evico GmbH, General Electric Co., Hitachi Ltd., Janis Research

Company, Inc., Luvata Pori OY, Oxford Instruments Plc, Scientific

Magnetics, Siemens AG, Sumitomo Electric Industries, Ltd., and

SuperPower, Inc. Market data and analytics are derived from primary and

secondary research.

Romanian Teenager Wins Big for Low-Cost, Self-Driving Car Innovation

Fri, 17 May 2013 13:09:56 CDT

Ionut Budisteanu of Romania Wins Top Prize at Intel International Science and Engineering FairNEWS HIGHLIGHTSThe world's largest high school science research competition, the Intel International Science and Engineering Fair, a program of Society for Science & the Public, announced its top winners in Phoenix.Ionut Budisteanu of Romania received the Gordon E. Moore Award, a $75,000 prize named in honor of the Intel co-founder and fellow scientist.Two Intel Foundation Young Scientist Awards winners – Eesha Khare of Saratoga, Calif. and Henry Lin of Shreveport, La. – each received prizes of $50,000 from the Intel Foundation. PHOENIX, May 17, 2013 – Ionut Budisteanu, 19, of Romania was awarded first place for using artificial intelligence to create a viable model for a low-cost, self-driving car at this year's Intel International Science and Engineering Fair, a program of Society for Science & the Public.Ionut said his research addresses a major global issue. In 2004, car accidents caused 2.5 million deaths worldwide1, and 87 percent of crashes resulted from driver error2. With 3-D radar and mounted cameras, Ionut created a feasible design for an autonomously controlled car that could detect traffic lanes and curbs, along with the real-time position of the car – and it would only cost $4,000. He received the Gordon E. Moore Award of $75,000, named in honor of the Intel co-founder and fellow scientist.Eesha Khare, 18, of Saratoga, Calif. received the Intel Foundation Young Scientist Award of $50,000. With the rapid adoption of portable electronics, Eesha recognized the crucial need for energy-efficient storage devices. She developed a tiny device that fits inside cell phone batteries, allowing them to fully charge within 20-30 seconds. Eesha's invention also has potential applications for car batteries.Henry Lin, 17, of Shreveport, La. also received the Intel Foundation Young Scientist Award of $50,000. By simulating thousands of clusters of galaxies, Henry has provided scientists with valuable new data, allowing them to better understand the mysteries of astrophysics: dark matter, dark energy and the balance of heating and cooling in the universe's most massive objects."We support the Intel International Science and Engineering Fair because we believe that science and math are the foundation of innovation, which is imperative for global economic growth and advancing society," said Wendy Hawkins, executive director of the Intel Foundation. "This competition encourages millions of students worldwide every year to explore their passion for math and science while developing solutions for global challenges."This year, approximately 1,600 young scientists were chosen to compete in the Intel International Science and Engineering Fair. They were selected from 433 affiliate fairs in more than 70 countries, regions and territories. In addition to the winners mentioned above, more than 500 finalists received awards and prizes for their innovative research. Awards included 17 "Best of Category" winners who each received a $5,000 prize. The Intel Foundation also awarded a $1,000 grant to each winner's school and to the affiliated fair they represent.The following lists the 17 Best of Category winners from which the top three were chosen:CategoryFirstLastCityState/CountryAnimal SciencesMichaelShaoNorthvilleMich.Behavioral and Social SciencesZarinRahmanBrookingsS.D.BiochemistrySavannahTobinSalemOre.Cellular and Molecular BiologyHannahWastykPalmyraPa.ChemistryEeshaKhareSaratogaCalif.Computer ScienceIonutBudisteanuRamnicu, ValceaRomaniaEarth and Planetary SciencesGyouTanakaMobara, ChibaJapanEngineering: Electrical and MechanicalZeyuLiuCalgary, AlbertaCanadaEngineering: Materials and BioengineeringSamanthaMarquezMidlothianVa.Energy and TransportationEvieSobczakSt. PetersburgFla.Environmental ManagementShixuanLiLynn HavenFla.Environmental SciencesNaomiShahPortlandOre.Mathematical SciencesVinayIyengarPortlandOre.Medicine and HealthJessieMacAlpineWoodstock, OntarioCanadaMicrobiologyDavidZimmermanLos AngelesCalif.Physics and AstronomyHenryLinShreveportLa.Plant SciencesSamanthaDiSalvoHewlettN.Y.RyanKennyAmyVithaSociety for Science & the Public, a nonprofit membership organization dedicated to public engagement in scientific research and education, has owned and administered the International Science and Engineering Fair since its inception in 1950."We congratulate Ionut, Eesha and Henry on their success at the Intel International Science and Engineering Fair this week in Phoenix," said Elizabeth Marincola, president of Society for Science & the Public. "Their research demonstrates the value of hard work and creative thinking. All the Intel International Science and Engineering Fair finalists here this week show great promise in harnessing the power of science and innovation to solve problems and create opportunity for our global community."The Intel International Science and Engineering Fair honors some of the world's most promising, rising student entrepreneurs, innovators and scientists. Finalists are selected annually from hundreds of affiliated fairs. Their projects are then evaluated onsite by more than 1,200 judges from nearly every scientific discipline, each with a Ph.D. or the equivalent of 6 years of related professional experience in one of the scientific disciplines.This is the first year that all Intel International Science and Engineering Fair finalists will receive digital badges recognizing and rewarding their achievements in independent scientific and engineering research. Volunteers, judges and interpreters will also receive badges. Digital badges promote informal modes of education and provide recognition and credentialing for achievements beyond the classroom. Learn more about the badging initiative at http://badging.societyforscience.org.A full listing of finalists is available in the event program. The Intel International Science and Engineering Fair 2013 is funded jointly by Intel and the Intel Foundation with additional awards and support from dozens of other corporate, academic, governmental and science-focused organizations. This year, more than $4 million was awarded.To learn more about Society for Science & the Public, visit www.societyforscience.org, and follow the organization on Facebook and Twitter.To get the latest Intel education news, visit www.intel.com/newsroom/education, and join the conversation on Facebook and Twitter.PHOENIX, May 17, 2013 – Top winner Ionut Budisteanu, 19, of Romania (center) with second-place winners Eesha Khare, 18, of Saratoga, Calif. (left) and Henry Lin, 17, of Shreveport, La. celebrate their awards at the Intel International Science and Engineering Fair, the world's largest high school science research competition. More than 1,600 high schoolers from 70 countries, regions and territories competed for more than $4 million in awards this week. PHOTO CREDIT: Intel/Chris Ayers About IntelIntel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.Intel is a trademark of Intel Corporation in the United States and other countries.* Other names and brands may be claimed as the property of others.1 World report on road traffic injury prevention, WHO, 2004 (from Ionut’s research)2 A study using British and American crash reports as data (from Ionut’s research)

Innovative Solar and Lithium Ion Battery Model Cars Take to the Racetrack on Saturday

Fri, 17 May 2013 02:00:00 CDT

Middle school students from around Colorado will participate in the Junior Solar Sprint and Lithium Ion Battery car competitions on Saturday, May 18, at Dakota Ridge High School in Littleton. Sponsored by the U.S. Department of Energy's National Renewable Energy Laboratory (NREL), the competitions give students the opportunity to show their engineering and design skills by building and racing high-performance model solar and battery vehicles.

Employee Engagement and Sustainability Thrive at Intel

Thu, 16 May 2013 12:00:18 CDT

2012 Corporate Responsibility Report ReleasedNEWS HIGHLIGHTSEmployee Engagement: Intel links a portion of every employee's compensation to sustainability goals, focusing on carbon emission reductions in 2012 and waste recycling in 2013.Environment: In 2013, Intel is increasing its green power purchases to equal 100 percent of the company's projected U.S. electricity use for the year.Supply Chain Responsibility: Intel achieved its goal to manufacture a "conflict-free" microprocessor for the metal tantalum.Education: Intel partnered on the "Girl Rising" film and 10x10 social action campaign, highlighting the importance of investing in the education of girls and women. SANTA CLARA, Calif., May 16, 2013 – Intel Corporation today released its 2012 Corporate Responsibility Report, highlighting the company's performance in areas including employee engagement, environmental sustainability, supply chain systems and education. The report also showcases Intel's progress toward its 2020 environmental goals that aim to drive continuous improvement in the company's manufacturing operations and the energy efficiency of its products."Intel's annual Corporate Responsibility Report allows us to transparently track our progress and aggressively work toward new goals in areas ranging from supply chain responsibility to K-12 education," said Michael Jacobson, director of corporate responsibility at Intel. "Embedding corporate responsibility into our vision, strategy and management systems creates value for us, as well as our stockholders, customers and our global communities."Building on its nearly 2 decades of reporting, Intel is continuing to promote transparency in its performance and actions. Highlights from the 2012 report include:Employee EngagementSince 2008, Intel has linked a portion of every employee's compensation to environmental goals, focusing on carbon emission reductions in 2012 and solid waste recycling in 2013.Through Intel Involved, employees in 2012 donated 1.2 million hours of service to more than 5,400 schools and nonprofit organizations in 42 countries, bringing the total donated hours to more than 5 million over the past 5 years.Twelve employee teams received Intel Environmental Excellence Awards for sustainability projects, generating more than $40 million in estimated savings in 2012 and totaling more than $200 million in savings over the past 3 years.Through Intel's Sustainability in Action grant program, nine teams of employees received grants in 2012 for environmental projects ranging from planting a vegetable garden at a children's home in Singapore to developing a water purification system in rural India.Renewable PowerFor the past 5 years, the U.S. Environmental Protection Agency has recognized Intel as the largest voluntary purchaser of green power in the nation. In 2013, Intel will increase its green power purchases to nearly 3.1 billion kilowatt-hours (kWh), equivalent to 100 percent of the company's projected U.S. electricity use for the year and equal to the annual electricity use of more than 320,000 U.S. homes.Since 2009, Intel has partnered with third parties to complete 18 solar installations on nine Intel campuses in the United States, Israel and Vietnam, generating more than 10 million kWh of energy per year.1Green Building Design and LEED CertificationAs of April 2013, Intel has achieved Leadership in Energy and Environmental Design (LEED) certification for 29 new and existing buildings, with a total of more than 7.5 million square feet of floor space.Supply Chain ResponsibilityIn 2012, Intel achieved its goal to manufacture a microprocessor that has been verified as "conflict-free" for the metal tantalum.Intel ranked seventh on the 2012 "Gartner Supply Chain Top 25" list for excellence in supply chain management, up from 16th in 2011 and 18th in 2010.Intel convened its first Supplier Sustainability Leadership Summit in China to advance supplier responsibility performance. The company also requested that its top 75 suppliers publish a Global Reporting Initiative-based report by the end of 2013 to promote greater transparency.EducationIntel and the Intel Foundation invest approximately $100 million annually in education programs globally, including the Intel Science Talent Search and the Intel International Science and Engineering Fair, both programs of Society for Science and the Public, which reached 7 million high school students in 2012 alone.In 2012, Intel partnered on the launch of the "Girl Rising" film and 10x10 social action campaign, which highlights the importance of investing in girls and women education.Intel has provided public reports on its environmental, health and safety performance since 1994 and produced an annual Corporate Responsibility Report since 2001. To read the new report, visit www.intel.com/go/responsibility. More information on Intel's corporate responsibility programs can be found at the CSR@Intel blog and on Twitter. About IntelIntel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world’s computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.Intel is a trademark of Intel Corporation in the United States and other countries.* Other names and brands may be claimed as the property of others.1 Renewable Energy Credits generated by these installations are often transferred to local utilities to support their regulatory obligations and programs.