Printed Electronics | Advanced Technology Research (ATR) News Wire

Embedded Components: A Rapidly Growing Field

Fri, 10 May 2013 06:30:00 CDT

Developers who want to gain the benefits in size and performance of

embedded components need to understand some critical points before

joining in this new trend. The complexity of printed boards is

poised for a significant change as embedded components become more

common. A growing number of OEMs and printed board suppliers are burying

passives and actives in printed boards as a way to trim both costs and

size. Vendors are seeing increasing interest. Embedded

components are gaining more interest from our customer base, since it is

one way to miniaturize electronics. We see requests from medical, industrial

sensors, mobile devices and initial interest in automotive for special

applications.

Flexible Applications Based on Printed Electronics Technologies

Wed, 01 May 2013 00:00:00 CDT

Today flexible & printed electronics create a lot of hope. And a

supply chain is being created to support an industrial infrastructure.

In our report, we have identified and tracked the five main

functionalities of flexible & printed electronics: displaying,

sensing, lighting, energy generating and substrates. We estimate the printed & flexible electronics market will grow from

~ $176M in 2013 to ~$950M in 2020 with a 27% CAGR in market value.

Printed OLED displays for large size (TVs) are likely to become the

largest market. For OLED lighting, we believe it will grow but remain a

niche market for automotive and/ or office lighting. For PV, the market

demand by 2020 will remain very low compared to the demand for rigid PV,

largely below 1% of the global market demand by 2020.

Global Market for Flexible Devices Manufactured by Roll-to-Roll (R2R) Technologies to Reach $22.7 Billion by 2017

Tue, 30 Apr 2013 09:30:00 CDT

The global market for flexible devices manufactured by roll-to-roll

(R2R) technologies increased from $8.5 billion in 2010 to nearly $10

billion in 2011, and was valued at nearly $10.8 billion in 2012, growing

at a compound annual growth rate (CAGR) of 12.3% during the two-year

period. Circuit devices currently account for a nearly 96.9%

share of all revenues in 2012. Sales within this segment are primarily

associated with flexible printed circuits. Displays and other

optoelectronic devices account for a 2.5% share of the R2R flexible

devices market, with total 2012 revenues of $264 million, while solar

cells, sensors, and other emerging applications currently represent a

combined share of only 0.7% of the total. The diffusion of R2R

technologies is expected to have a marked effect in lowering the unit

prices of these devices. Consequently, while consumption in terms of

volume is forecast to rise very rapidly, revenues will increase somewhat

more moderately. As a result, the total market for R2R flexible devices

is forecast to grow at a CAGR of 16.1% from 2012 to 2017, reaching

global revenues of nearly $22.7 billion by 2017.

Printed, Organic & Flexible Electronics: Forecasts, Players & Opportunities 2013-2023

Fri, 26 Apr 2013 00:00:00 CDT

This report provides the most comprehensive view of the topic, giving

detailed ten year forecasts by device type. The market is analyzed by

territory, printed vs non printed, rigid vs flexible, inorganic vs

organic, cost of materials vs process cost and much more, with over 160

tables and figures. Activities of over 1,000 leading companies are

given, as is assessment of the winners and losers to come.

Barrier Films for Flexible Electronics 2013-2023: Needs, Players, Opportunities

Mon, 22 Apr 2013 00:00:00 CDT

A large opportunity lies in the development of devices in a flexible

form factor that can operate without deterioration in performance,

allowing them to be more robust, lightweight and versatile in their use.

In order for flexible displays and photovoltaics to be commercially

successful, they must be robust enough to survive for the necessary time

and conditions required of the device. This condition has been a

limitation of many flexible, organic or printable electronics. This

highlights the fact that beyond flexibility, printability and

functionality, one of the most important requirements is encapsulation

as many of the materials used in printed or organic electronic displays

are chemically sensitive, and will react with many environmental

components such as oxygen and moisture.

Requirements for Printed Electronics Base Materials (Substrates)

Wed, 10 Apr 2013 00:00:00 CDT

This document provides comprehensive data to help users more easily

determine both material capability and compatibility for flexible and

rigid base dielectric materials for manufacture of printed electronics.

It includes base material specification sheets that have been updated

with the newest properties for the specification material types. It

establishes the most current classification system, qualification and

quality conformance requirements, including those raw material

properties of particular interest to the printed electronics designer,

fabricator, or user. This standard is a joint standard published by IPC

and JPCA, Japan Electronics Packaging and Circuits Association.

Global Printed Electronics Market—Analyzing the True Potential

Wed, 03 Apr 2013 00:00:00 CDT

New analysis, Global

Printed Electronics Market—Analyzing the True Potential, finds that the market

earned revenue of over $321.8 million in 2010 and estimates this to reach $943.7

million in 2017. Printed electronics companies can tap into fresh

application sectors by making the manufacturing process efficient and

affordable. Printing technologies are receiving increased attention from

numerous application sectors since they can be patterned on any substrate by

using various functional materials. The substrates include flexible media such

as paper, textiles, and plastics.

IPC Technology Roadmap Takes Many New Directions

Wed, 20 Mar 2013 08:30:00 CDT

Industry roadmaps predict the future in many ways, beginning with an

in-depth analysis of the technologies used in their industry. They can

also herald shifts in the way that an industry is meeting its

challenges. The 2013 IPC International Technology Roadmap for

Electronic Interconnections marks a shift that's occurring throughout

the electronics industry: there's more cooperation and information

sharing. As technologies get more complex, it's critical to have

information on all aspects that impact a technology, from initial design

to manufacturing processes and products. IPC is meeting this

challenge by working closely with iNEMI, among others, helping in some

research projects and gleaning data from areas that are at the core of

iNEMI's roadmapping efforts. The IPC roadmap also utilizes information

from the International Technology Roadmap for Semiconductors, as well as

from the Japan Printed Circuit Association (JPCA).

Printed and Thin Film Transistors (TFT) and Memory 2012-2022: Forecasts, Technologies, Players

Mon, 18 Mar 2013 00:00:00 CDT

Printed and thin film transistor circuits will become a $3.5 billion

market in 10 years, from just $2 million in 2012. They will drive

lighting, displays, signage, electronic products, medical disposables,

smart packaging, smart labels and much more besides. The chemical,

plastics, printing, electronics and other industries are cooperating to

make it happen. Already, over 500 organizations are developing printed

transistors and memory, with first products being sold commercially in

2009. The growth over the longer timescale, from 2012-2032, will

be very similar to the early growth of the silicon chip market in the

same interval. In other words, the twenty years from 1978 to 1998 saw a

similar starting and finishing value of sales of silicon chips. History

is repeating itself with the printed equivalent over the next twenty

years, though not by taking much market share from silicon chips in the

first fifteen years. Do not follow the herd into the well aired aspects

of this subject. Gain advantage by understanding all the important

aspects and opportunities.

Requirements for Printed Electronics Functional Conductive Materials

Sat, 02 Mar 2013 00:00:00 CST

This document provides comprehensive data to help users more easily

determine material performance, capabilities, and compatibility of

functional conductive materials for the manufacture of printed

electronics. It includes:

• classification schemes based on composition, conductor type, and

post-processing structure;

• functional conductive material specification sheets to present

properties for the different conductive material types; and

• the most current classification system, qualification and quality

conformance requirements, including those raw material properties of

particular interest to the printed electronics designer, fabricator, or

other user.

This standard is a joint standard published by IPC and JPCA, Japan

Electronics Packaging and Circuits Association.